TY - GEN
T1 - An Active Gate Driver Addressing GaN HEMT Gate-Source Voltage Overshoots for Both Turn-on and Turn-off Periods
AU - Wang, Lurenhang
AU - Yan, Yishun
AU - Zhi, Shuaiqing
AU - Ma, Mingcheng
AU - Sun, Xizhi
AU - Xu, Dianguo
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025
Y1 - 2025
N2 - Compared with traditional Si MOSFETs, GaN HEMTs have faster turn-on and turn-off speeds and are often used in high-frequency applications. However, the high dv/dt generated by high-frequency switching causes displacement current to flow into the gate drive circuit through the Cgd. High di/dt generates EMI (electromagnetic interference) that also affects the drive circuit, and it is also present in the gate drive circuit. Both of these can cause serious interference in the drive circuit, resulting in positive or negative spikes in the gate-source voltage. These spikes can easily break down the gate, which challenges the safety of GaN HEMTs. To address this problem, we have designed an active gate driver addressing GaN HEMT gate-source voltage overshoots for both turn-on and turn-off periods. The reliability of GaN HEMT applications is improved by connecting a gate capacitor at the right moment to absorb the forward or reverse spikes. In the double pulse test (DPT), at 400 V/16 A, the positive gate-source voltage spike was reduced by 51.5% relative to CGD when the turn-on time was only 3.5 ns. The negative gate-source voltage spike was reduced by 47.6% relative to CGD when the turn-off time was only 5.2 ns. This effectively proves the effectiveness of the designed AGD.
AB - Compared with traditional Si MOSFETs, GaN HEMTs have faster turn-on and turn-off speeds and are often used in high-frequency applications. However, the high dv/dt generated by high-frequency switching causes displacement current to flow into the gate drive circuit through the Cgd. High di/dt generates EMI (electromagnetic interference) that also affects the drive circuit, and it is also present in the gate drive circuit. Both of these can cause serious interference in the drive circuit, resulting in positive or negative spikes in the gate-source voltage. These spikes can easily break down the gate, which challenges the safety of GaN HEMTs. To address this problem, we have designed an active gate driver addressing GaN HEMT gate-source voltage overshoots for both turn-on and turn-off periods. The reliability of GaN HEMT applications is improved by connecting a gate capacitor at the right moment to absorb the forward or reverse spikes. In the double pulse test (DPT), at 400 V/16 A, the positive gate-source voltage spike was reduced by 51.5% relative to CGD when the turn-on time was only 3.5 ns. The negative gate-source voltage spike was reduced by 47.6% relative to CGD when the turn-off time was only 5.2 ns. This effectively proves the effectiveness of the designed AGD.
KW - GaN HEMT
KW - active gate driver
KW - gate-source voltage
KW - voltage overshoots suppression
UR - https://www.scopus.com/pages/publications/105019966353
U2 - 10.1109/WiPDA-Asia63772.2025.11184066
DO - 10.1109/WiPDA-Asia63772.2025.11184066
M3 - 会议稿件
AN - SCOPUS:105019966353
T3 - 2025 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2025
BT - 2025 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2025
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2025 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2025
Y2 - 15 August 2025 through 17 August 2025
ER -