Abstract
In this paper, high strength Cu-Cu interconnections were achieved by sintering the paste of Ag-Sn bimetallic nanoparticles at low temperature. Compared with nano-Ag paste, the outer Sn coatings of the nano-Ag particles were found to be favorable for the densification of the bondline. The microstructures of Ag-Sn bimetallic nanoparticles and the bondlines under different sintereing conditions were studied in detail by x-ray photoelectron spectroscopy (XPS), x-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). The Ag-Sn bimetallic nanoparticles bondline exhibit a high shear strength of 35.3 MPa and a low resistivity of 9.5 μΩ cm, when sintered at 260 C for 20 min under a pressure of 0.5 MPa. The electrochemical migration time of this sintered Ag-Sn bimetallic nanoparticles was prolonged to be ten times of that of sintered nano-Ag. This bonding technology based on Ag-Sn bimetallic nanoparticles was a promising die attach method for high temperature power device packaging.
| Original language | English |
|---|---|
| Article number | 345204 |
| Journal | Nanotechnology |
| Volume | 31 |
| Issue number | 34 |
| DOIs | |
| State | Published - 21 Aug 2020 |
| Externally published | Yes |
Keywords
- die attach
- electrochemical migration
- intermetallics
- nanoparticle
- power device packaging
- sintering
Fingerprint
Dive into the research topics of 'Ag-Sn bimetallic nanoparticles paste for high temperature service in power devices'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver