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Ag nanoparticles-Based hybrid Ink with low metallization temperature

  • Yong D. Han
  • , Si M. Zhang
  • , Hong Y. Jing
  • , Jun Wei
  • , Fan H. Bu
  • , Lei Zhao
  • , Xiao Q. Lv
  • , Lian Y. Xu*
  • *Corresponding author for this work
  • Tianjin University
  • Tianjin Key Laboratory of Advanced Joining Technology
  • Agency for Science, Technology and Research, Singapore

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

With the aim of developing highly conductive ink for writing electronics on heat-sensitive substrates, Ag nanospheres and nanoplates were mixed to synthesize hybrid inks. Five kinds of hybrid ink and two types of pure ink were written to square shape on Epson photo paper using rollerball pens and sintered at a low temperature (100 V). The microstructure, electrical resistivity, surface porosity, hardness and flexibility of silver patterns were systematically investigated and compared. It was observed that the optimal mixing ratio of nanospheres and nanoplates was 1:1, which equipped the directly written pattern with excellent electrical and mechanical properties. The electrical resistivity was 0.103 μΩ·m, which was only 6.5 times of bulk silver. The enhancement compared to pure silver nanospheres or nanoplates based ink was owing to the combined action of nanospheres and nanoplates. It was a valued way to prepare Ag nanoink with good performance for printed/written electronics.

Original languageEnglish
Title of host publication2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-6
Number of pages6
ISBN (Electronic)9781538630426
DOIs
StatePublished - 2 Jul 2017
Externally publishedYes
Event2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017 - Singapore, Singapore
Duration: 6 Dec 20179 Dec 2017

Publication series

Name2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
Volume2018-February

Conference

Conference2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017
Country/TerritorySingapore
CitySingapore
Period6/12/179/12/17

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