Adhesion of silicon to the tool during diamond cutting silicon by molecular dynamics

Wear of diamond tool is also very serious, which affects the surface quality of the machined work material, even if ductile mode where an undeformed chip thickness is at a nano scale is used. During the cutting process, the crystal structure in the cutting zone is destroyed under the high pressures applied by the diamond tool. The silicon atoms adhering to the tool surface reconstruct to be in a crystal state under the effect of adhesion and pressures.