TY - GEN
T1 - Adhesion behavior of WC coating deposited on titanium alloy by electrospark deposition
AU - He, P.
AU - Qian, Y. Y.
AU - Chang, Z. L.
AU - Wang, R. J.
PY - 2007
Y1 - 2007
N2 - Electro-spark deposition process is widely applied in many fields, such as aviation industry, space technology, energy industry, nuclear reactor and medical apparatus and instruments industry due to its low-heat input, little distortion in base, and easy operation. At present time, a lot of investigations have been done and a lot of results obtained, but there are still a lot of things to be done in the theoretical investigation. For this reason, the forming principle of spot and the adhesion of electrode and the interface behavior have been investigated in this article. When WC electrode was used to deposit TC1 substrate, the adhesion of electrode, which affects the transferring process, was investigated and analyzed. Adhesion, which often produces a thin layer of mixture on the surface of the WC electrode, in the adhesion layer metallurgy reaction occurs and TiC new phase forms.
AB - Electro-spark deposition process is widely applied in many fields, such as aviation industry, space technology, energy industry, nuclear reactor and medical apparatus and instruments industry due to its low-heat input, little distortion in base, and easy operation. At present time, a lot of investigations have been done and a lot of results obtained, but there are still a lot of things to be done in the theoretical investigation. For this reason, the forming principle of spot and the adhesion of electrode and the interface behavior have been investigated in this article. When WC electrode was used to deposit TC1 substrate, the adhesion of electrode, which affects the transferring process, was investigated and analyzed. Adhesion, which often produces a thin layer of mixture on the surface of the WC electrode, in the adhesion layer metallurgy reaction occurs and TiC new phase forms.
KW - Adhesion
KW - Coating
KW - Electro-spark
KW - Titanium alloy
UR - https://www.scopus.com/pages/publications/37549053194
U2 - 10.4028/3-908451-33-7.325
DO - 10.4028/3-908451-33-7.325
M3 - 会议稿件
AN - SCOPUS:37549053194
SN - 9783908451334
T3 - Solid State Phenomena
SP - 325
EP - 330
BT - Designing of Interfacial Structures in Advanced Materials and their Joints - Proceedings of the Int. Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS'06
PB - Trans Tech Publications Ltd
T2 - International Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS'06
Y2 - 18 May 2006 through 20 May 2006
ER -