@inproceedings{b773774705c3472ebf3e04c0e5474458,
title = "Abnormal grain growth in Cu6Sn5 Grains formed at SN-based solder/Cu interfaces",
abstract = "Intermetallic compounds (IMCs) that form at eutectic Sn3.5Ag/Cu and pure Sn/Cu interfaces during solid-state aging are comparatively studied in terms of their respective morphological formations. During solid-state aging, all the interfacial Cu6Sn5 grains evolve into a layer-type morphology, except for select grains that experience abnormal growth. This abnormal growth is caused by the preferential growth of the Cu6Sn5 at the grain boundary in solder matrix. Additionally, the effects of solder composition on the interfacial IMC growth are evaluated. The results indicate that the Ag addition retards IMC growth upon aging by inhibiting the diffusion of Cu.",
keywords = "IMC, abnormal growth, diffusion, lead-free solders",
author = "Ming Yang and Mingyu Li and Jianxin Wu and Jinhua Xu",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 ; Conference date: 12-08-2014 Through 15-08-2014",
year = "2014",
month = oct,
day = "13",
doi = "10.1109/ICEPT.2014.6922854",
language = "英语",
series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1181--1185",
editor = "Keyun Bi and Zhong Tian and Ziqiang Xu",
booktitle = "2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014",
address = "美国",
}