A universal approach to high-performance thermoelectric module design for power generation

Thermoelectric modules fabricated by traditional welding fall short of achieving optimal conversion efficiencies, primarily due to performance degradation of materials at high temperatures, severe elemental diffusion, and residual thermal stress at the interface. Transient liquid phase bonding enables the realization of joints with high-melting-point compounds at low bonding temperatures, providing a promising solution for achieving “low-temperature bonding and high-temperature service.” Owing to the low eutectic point of the solder and high melting points of compounds, we optimize the design of a germanium-telluride-based module at 533 K, which is successfully applied at the hot-side temperature of 773 K. Attributed to high-performance materials and reliable joints, the module realizes a high conversion efficiency of ∼15.1% and remains stable throughout 150 h of service. By adopting the same approach, the low- (Bi₂Te₃) and high-temperature (half-Heusler) modules are assembled. We provide a promising and general route for the assembly of full-temperature-range thermoelectric devices.