TY - GEN
T1 - A Study on the Preparation and Properties of Conductive Adhesive Filled with Multi-component Fillers for Green Packaging
AU - Zhang, Shuye
AU - Yang, Ming
AU - Zhang, Yanxin
AU - Wang, Qian
AU - Lin, Tiesong
AU - He, Peng
AU - Paik, Kyung Wook
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/7/2
Y1 - 2018/7/2
N2 - For the development of electronic packaging products, the mixture of micron-filler and nano-filler was adopted to improve the electronic property of conductive adhesive. The porpose of the addition of micron-filler and nano-filler is to achieve a higher conductive property, so that the perfect conductive adhesive could be obtained by the optimized conductive fillers. The conductive filler composed of Cu powders coated by nano-Ag layer and silver nanowire and resin matrix were mixed to fabricate conductive adhesive. The conductive filler composed of Cu powder coated by nano-Ag layer and silver nanowire could reduce the bulk resistivity and percolation threshold of conductive adhesive. When the conductive adhesive was cured at 170° for 60min using Cu powder coated by nano-Ag layer and silver nanowire as conductive filler and the content of filler was 60wt.%, the bulk resistivity of the newly formed conductive adhesive was low to 6.53 × 10-5 Ω · cm, while the shear strength of the adhesive was 5.36MPa.
AB - For the development of electronic packaging products, the mixture of micron-filler and nano-filler was adopted to improve the electronic property of conductive adhesive. The porpose of the addition of micron-filler and nano-filler is to achieve a higher conductive property, so that the perfect conductive adhesive could be obtained by the optimized conductive fillers. The conductive filler composed of Cu powders coated by nano-Ag layer and silver nanowire and resin matrix were mixed to fabricate conductive adhesive. The conductive filler composed of Cu powder coated by nano-Ag layer and silver nanowire could reduce the bulk resistivity and percolation threshold of conductive adhesive. When the conductive adhesive was cured at 170° for 60min using Cu powder coated by nano-Ag layer and silver nanowire as conductive filler and the content of filler was 60wt.%, the bulk resistivity of the newly formed conductive adhesive was low to 6.53 × 10-5 Ω · cm, while the shear strength of the adhesive was 5.36MPa.
UR - https://www.scopus.com/pages/publications/85063906256
U2 - 10.1109/EMAP.2018.8660805
DO - 10.1109/EMAP.2018.8660805
M3 - 会议稿件
AN - SCOPUS:85063906256
T3 - EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging
BT - EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Electronic Materials and Packaging, EMAP 2018
Y2 - 17 December 2018 through 20 December 2018
ER -