TY - GEN
T1 - A Study on Improving the Consistency of the Contact System in Half Size Relay Based on Optimal Stress-Relief Parameters of Ag-Mg-Ni Materials
AU - Zhang, Yongjian
AU - You, Jiaxin
AU - Wu, Di
AU - Qiao, Yufei
AU - Li, Yuexian
N1 - Publisher Copyright:
© Beijing Paike Culture Commu. Co., Ltd. 2026.
PY - 2026
Y1 - 2026
N2 - The half size hermetically sealed electromagnetic relay (HSER), widely used in aerospace applications, offers advantages such as compact size, light weight, and strong environmental adaptability. With increasing demands for system reliability, the performance consistency of relay batches has become a critical determinant of overall system dependability. Among the influencing factors, the alignment between actuation and counterforce plays a decisive role in HSER performance. Consequently, consistency in the actuation-counterforce system has emerged as a growing design requirement. This study focuses on improving batch-level counterforce consistency using a representative HSER model. Key production processes are analyzed for variability, with particular attention to the overlap risk in the actuation force curves near the pickup voltage. Critical points on the counterforce curve are identified and examined. Based on the residual stress relief mechanism and the tuning process of the movable spring, a dedicated experimental plan is established to optimize the baking process—a key influencing step for counterforce consistency. Through experimental analysis, optimal stress-relief parameters for Ag-Mg-Ni alloy materials are determined. To ensure practical implementation of the proposed consistency design, an automated spring contact detection and tuning system is developed using a Python-based visual recognition platform. This system enables integrated control of both the baking and spring-tuning stages. Finally, statistical analysis of the counterforce curve bands confirms the effectiveness of the proposed method for enhancing system consistency, validating the approach based on optimized stress-relief parameters for Ag-Mg-Ni materials.
AB - The half size hermetically sealed electromagnetic relay (HSER), widely used in aerospace applications, offers advantages such as compact size, light weight, and strong environmental adaptability. With increasing demands for system reliability, the performance consistency of relay batches has become a critical determinant of overall system dependability. Among the influencing factors, the alignment between actuation and counterforce plays a decisive role in HSER performance. Consequently, consistency in the actuation-counterforce system has emerged as a growing design requirement. This study focuses on improving batch-level counterforce consistency using a representative HSER model. Key production processes are analyzed for variability, with particular attention to the overlap risk in the actuation force curves near the pickup voltage. Critical points on the counterforce curve are identified and examined. Based on the residual stress relief mechanism and the tuning process of the movable spring, a dedicated experimental plan is established to optimize the baking process—a key influencing step for counterforce consistency. Through experimental analysis, optimal stress-relief parameters for Ag-Mg-Ni alloy materials are determined. To ensure practical implementation of the proposed consistency design, an automated spring contact detection and tuning system is developed using a Python-based visual recognition platform. This system enables integrated control of both the baking and spring-tuning stages. Finally, statistical analysis of the counterforce curve bands confirms the effectiveness of the proposed method for enhancing system consistency, validating the approach based on optimized stress-relief parameters for Ag-Mg-Ni materials.
KW - Consistency Improvements
KW - Contact System
KW - Hermetically Sealed Electromagnetic Relay
KW - Stress Relief
UR - https://www.scopus.com/pages/publications/105047279631
U2 - 10.1007/978-981-95-6942-7_59
DO - 10.1007/978-981-95-6942-7_59
M3 - 会议稿件
AN - SCOPUS:105047279631
SN - 9789819569410
T3 - Lecture Notes in Electrical Engineering
SP - 558
EP - 567
BT - The Proceedings of the 20th Annual Conference of China Electrotechnical Society Volume 3
A2 - Yang, Qingxin
A2 - Xu, Dianguo
A2 - Ye, Xuerong
A2 - Guan, Yueshi
A2 - Nie, Qiuyue
PB - Springer Science and Business Media Deutschland GmbH
T2 - 20th Annual Conference of China Electrotechnical Society, ACCES 2025
Y2 - 19 September 2025 through 21 September 2025
ER -