A study of the residual stress behavior of rigid and flexible epoxy adhesives during thermal cycle aging for electronics packaging

In the rapidly developing microelectronics industry and technology, epoxy resin based electrically conductive adhesives must be urgently improved in terms of aging resistance, especially residual stress caused by thermal cycle aging. In this study, we investigated the stress behavior of rigid and flexible epoxy systems blended with bisphenol F epoxy (BPF) and fatty acid epoxy. The curing processes, thermal, and thermomechanical properties of the modified epoxy systems were assessed comprehensively. Moreover, the residual stress during the thermal cycle was monitored, and the bond strength was characterized. The results pointed out that by introducing soft molecular segments into a rigid system, the modified epoxy resin system had significantly lower residual stress values and exhibited a higher bond strength over a wider temperature range. Finally, we envision the systematic integration of residual stress testing with material strength testing for quantifying the bond failure of adhesive layers in the near future.