@inproceedings{a8ed525b8deb4f69b026b8306b05f8ad,
title = "A Series-Fed Comb-Array Antenna with Microbumps for Sub-THz Applications",
abstract = "A novel series-fed comb-array antenna with microbumps based on high resistivity silicon (HRSi) is proposed for sub-Terahertz (THz) applications. The proposed antenna consists of eight circular patches as the radiating elements which are serially fed by a microstrip line. Eight microbumps in flip-chip technology are bonded on the circular patches to achieve a high gain and a high radiation efficiency w ithout a complex manufacturing process and high cost. The microstrip feed line is specially designed according to Chebyshev distribution for sidelobe level (SLL) suppression.",
keywords = "comb-array antenna, high resistivity silicon, microbump, sub-Terahertz",
author = "Kangliang Zhao and Yihong Xu and Zihao Chen and Kangrong Li and Baoxia Li",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 2024 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2024 ; Conference date: 25-10-2024 Through 27-10-2024",
year = "2024",
doi = "10.1109/ICTA64028.2024.10860394",
language = "英语",
series = "2024 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "90--91",
booktitle = "2024 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2024",
address = "美国",
}