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A reliability analysis method for electronic systems based on survival signature

  • Ziwen Xiao
  • , Yu Peng
  • , Sizhe Liu
  • , Yuhang Liu
  • , Zhiming Yang*
  • , Yang Yu
  • *Corresponding author for this work
  • Harbin Institute of Technology
  • Beijing Aerospace Automatic Control Institute

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Due to the complex structure and numerous electronic components, the reliability analysis of electronic systems has become more challenging. Therefore, we propose a reliability analysis method for electronic systems based on survival signature. The level of fault impact factors is evaluated based on the survival signature theory, and the weight of fault impact factors is evaluated through the analytic hierarchy process. This method simplifies the structural analysis process of complex systems, making reliability analysis more objective and efficient. The effectiveness of this method was verified through reliability analysis of the digital output control circuit.

Original languageEnglish
Title of host publicationThird International Conference on Electrical, Electronics, and Information Engineering, EEIE 2024
EditorsHasmat Malik
PublisherSPIE
ISBN (Electronic)9781510688179
DOIs
StatePublished - 2025
Event3rd International Conference on Electrical, Electronics, and Information Engineering, EEIE 2024 - Wuhan, China
Duration: 14 Nov 202416 Nov 2024

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume13512
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

Conference3rd International Conference on Electrical, Electronics, and Information Engineering, EEIE 2024
Country/TerritoryChina
CityWuhan
Period14/11/2416/11/24

Keywords

  • Electronic systems
  • analytic hierarchy process
  • reliability analysis
  • survival signature

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