@inproceedings{ad4e5951db214c5f94b5156c04fd8e19,
title = "A post-bond TSVs test solution for leakage fault",
abstract = "During the 3-D ICs manufacturing process, TSVs are susceptible to undergo different faults. Among these faults, the leakage fault is one of the most common cases. In this paper, a new test structure based on the improved ring oscillator circuit is proposed to detect the TSV leakage fault. An accurate TSV leakage fault model extracted from three-dimensional full-wave simulation is adopted in the test structure. HSPICE Monte Carlo simulation shows that the proposed test structure can detect the weak leakage faults with no less than 0.2025um2 pin-hole area, which is a larger coverage compared with the traditional test structure.",
keywords = "3-D ICs, Leakage fault, Ring oscillator, TSV test",
author = "Yang Yu and Zhiming Yang and Kangkang Xu",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 3rd IEEE International Test Conference in Asia, ITC-Asia 2019 ; Conference date: 03-09-2019 Through 05-09-2019",
year = "2019",
month = sep,
doi = "10.1109/ITC-Asia.2019.00035",
language = "英语",
series = "Proceedings - 2019 IEEE International Test Conference in Asia, ITC-Asia 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "127--132",
booktitle = "Proceedings - 2019 IEEE International Test Conference in Asia, ITC-Asia 2019",
address = "美国",
}