A novel ultrasonic consolidation method for rapid preparation of diamond/Cu composites

Bo Wang; Hongtao Zhang; Guo Yu; Rongmao Du; Peng He

doi:10.1016/j.matlet.2022.132498

A novel ultrasonic consolidation method for rapid preparation of diamond/Cu composites

Bo Wang
, Hongtao Zhang^*
, Guo Yu
, Rongmao Du
, Peng He

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

11 Scopus citations

Abstract

In this study, diamond/Cu composites were fabricated using ultrasonic consolidation and resistance rapid diffusion technology with Cr addition to improve the wettability between diamond and Cu martix, the interfacial configuration and thermal conductivity of diamond/Cu composites were also investigated. Excellent interfacial bonding between diamond and Cu matrix was achieved by surface metallization of diamond with Cr, and the formation of subgrain boundaries was observed in the Cr₇C₃ and Cu matrix grains near the interface. The thermal conductivity of the composite prepared by this process reaches 421.314 W/m·K when diamond added mass at 1.34%, which is 12% higher than that of the Cu matrix.

Original language	English
Article number	132498
Journal	Materials Letters
Volume	323
DOIs	https://doi.org/10.1016/j.matlet.2022.132498
State	Published - 15 Sep 2022

Keywords

Diamond/Cu composites
Interfaces
Laminates
Surface metalization
Thermal properties
Ultrasonic Consolidation

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10.1016/j.matlet.2022.132498

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@article{396d8220f8cd4d60ac9b59fd860b368f,

title = "A novel ultrasonic consolidation method for rapid preparation of diamond/Cu composites",

abstract = "In this study, diamond/Cu composites were fabricated using ultrasonic consolidation and resistance rapid diffusion technology with Cr addition to improve the wettability between diamond and Cu martix, the interfacial configuration and thermal conductivity of diamond/Cu composites were also investigated. Excellent interfacial bonding between diamond and Cu matrix was achieved by surface metallization of diamond with Cr, and the formation of subgrain boundaries was observed in the Cr7C3 and Cu matrix grains near the interface. The thermal conductivity of the composite prepared by this process reaches 421.314 W/m·K when diamond added mass at 1.34\%, which is 12\% higher than that of the Cu matrix.",

keywords = "Diamond/Cu composites, Interfaces, Laminates, Surface metalization, Thermal properties, Ultrasonic Consolidation",

author = "Bo Wang and Hongtao Zhang and Guo Yu and Rongmao Du and Peng He",

note = "Publisher Copyright: {\textcopyright} 2022 Elsevier B.V.",

year = "2022",

month = sep,

day = "15",

doi = "10.1016/j.matlet.2022.132498",

language = "英语",

volume = "323",

journal = "Materials Letters",

issn = "0167-577X",

publisher = "Elsevier B.V.",

}

TY - JOUR

T1 - A novel ultrasonic consolidation method for rapid preparation of diamond/Cu composites

AU - Wang, Bo

AU - Zhang, Hongtao

AU - Yu, Guo

AU - Du, Rongmao

AU - He, Peng

PY - 2022/9/15

Y1 - 2022/9/15

N2 - In this study, diamond/Cu composites were fabricated using ultrasonic consolidation and resistance rapid diffusion technology with Cr addition to improve the wettability between diamond and Cu martix, the interfacial configuration and thermal conductivity of diamond/Cu composites were also investigated. Excellent interfacial bonding between diamond and Cu matrix was achieved by surface metallization of diamond with Cr, and the formation of subgrain boundaries was observed in the Cr7C3 and Cu matrix grains near the interface. The thermal conductivity of the composite prepared by this process reaches 421.314 W/m·K when diamond added mass at 1.34%, which is 12% higher than that of the Cu matrix.

AB - In this study, diamond/Cu composites were fabricated using ultrasonic consolidation and resistance rapid diffusion technology with Cr addition to improve the wettability between diamond and Cu martix, the interfacial configuration and thermal conductivity of diamond/Cu composites were also investigated. Excellent interfacial bonding between diamond and Cu matrix was achieved by surface metallization of diamond with Cr, and the formation of subgrain boundaries was observed in the Cr7C3 and Cu matrix grains near the interface. The thermal conductivity of the composite prepared by this process reaches 421.314 W/m·K when diamond added mass at 1.34%, which is 12% higher than that of the Cu matrix.

KW - Diamond/Cu composites

KW - Interfaces

KW - Laminates

KW - Surface metalization

KW - Thermal properties

KW - Ultrasonic Consolidation

UR - https://www.scopus.com/pages/publications/85131217624

U2 - 10.1016/j.matlet.2022.132498

DO - 10.1016/j.matlet.2022.132498

M3 - 文章

AN - SCOPUS:85131217624

SN - 0167-577X

VL - 323

JO - Materials Letters

JF - Materials Letters

M1 - 132498

ER -

A novel ultrasonic consolidation method for rapid preparation of diamond/Cu composites

Abstract

Keywords

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