A novel surface humidity controlled bonder for low-Temperature wafer bonding

Chenxi Wang; Jikai Xu; Yannan Liu; Yanhong Tian; Chunqing Wang; Tadatomo Suga

doi:10.1109/ICEPT.2016.7583273

A novel surface humidity controlled bonder for low-Temperature wafer bonding

Chenxi Wang
, Jikai Xu
, Yannan Liu
, Yanhong Tian
, Chunqing Wang
, Tadatomo Suga

School of Materials Science and Engineering

Harbin Institute of Technology
The University of Tokyo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

Hydrophilic bonding is commonly used in the wafer bonding field. Water management is of great importance to obtain good bonding quality over the entire bonded pairs. However, current wafer bonding equipments do not have the function of regulating the surface humidity prior to bonding. It is difficult to make a quantitative study on the role of moistures in the bonding process. In this paper, a novel surface humidity controlled bonder is developed to optimize the water adsorption on the wafer surface prior to bonding and improve the bonding quality using cooling as well as heating functions. For the sufficient surface humidity, the water molecules may bond together via Si-OH groups on the silica surfaces, and then they can compensate the gap between the bonded wafers resulting a weak hydrogen-bonding connected Si-OH···(H₂O)_x ···HO-Si interface structure forming a good prebonding interface.

Original language	English
Title of host publication	2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016
Editors	Keyun Bi, Sheng Liu, Shengjun Zhou
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	893-896
Number of pages	4
ISBN (Electronic)	9781509013968
DOIs	https://doi.org/10.1109/ICEPT.2016.7583273
State	Published - 4 Oct 2016
Event	17th International Conference on Electronic Packaging Technology, ICEPT 2016 - Wuhan, China Duration: 16 Aug 2016 → 19 Aug 2016

Publication series

Name	2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016

Conference

Conference	17th International Conference on Electronic Packaging Technology, ICEPT 2016
Country/Territory	China
City	Wuhan
Period	16/08/16 → 19/08/16

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 6 Clean Water and Sanitation

Keywords

humidity controlled
low temperature
wafer bonder

Access to Document

10.1109/ICEPT.2016.7583273

Cite this

Wang, C., Xu, J., Liu, Y., Tian, Y., Wang, C., & Suga, T. (2016). A novel surface humidity controlled bonder for low-Temperature wafer bonding. In K. Bi, S. Liu, & S. Zhou (Eds.), 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016 (pp. 893-896). Article 7583273 (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEPT.2016.7583273

Wang, Chenxi ; Xu, Jikai ; Liu, Yannan et al. / A novel surface humidity controlled bonder for low-Temperature wafer bonding. 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. editor / Keyun Bi ; Sheng Liu ; Shengjun Zhou. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 893-896 (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016).

@inproceedings{23b4d9cdd6094bedbc52ca03c6732966,

title = "A novel surface humidity controlled bonder for low-Temperature wafer bonding",

abstract = "Hydrophilic bonding is commonly used in the wafer bonding field. Water management is of great importance to obtain good bonding quality over the entire bonded pairs. However, current wafer bonding equipments do not have the function of regulating the surface humidity prior to bonding. It is difficult to make a quantitative study on the role of moistures in the bonding process. In this paper, a novel surface humidity controlled bonder is developed to optimize the water adsorption on the wafer surface prior to bonding and improve the bonding quality using cooling as well as heating functions. For the sufficient surface humidity, the water molecules may bond together via Si-OH groups on the silica surfaces, and then they can compensate the gap between the bonded wafers resulting a weak hydrogen-bonding connected Si-OH···(H2O)x ···HO-Si interface structure forming a good prebonding interface.",

keywords = "humidity controlled, low temperature, wafer bonder",

author = "Chenxi Wang and Jikai Xu and Yannan Liu and Yanhong Tian and Chunqing Wang and Tadatomo Suga",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 17th International Conference on Electronic Packaging Technology, ICEPT 2016 ; Conference date: 16-08-2016 Through 19-08-2016",

year = "2016",

month = oct,

day = "4",

doi = "10.1109/ICEPT.2016.7583273",

language = "英语",

series = "2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "893--896",

editor = "Keyun Bi and Sheng Liu and Shengjun Zhou",

booktitle = "2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016",

address = "美国",

}

Wang, C, Xu, J, Liu, Y, Tian, Y, Wang, C & Suga, T 2016, A novel surface humidity controlled bonder for low-Temperature wafer bonding. in K Bi, S Liu & S Zhou (eds), 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016., 7583273, 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Institute of Electrical and Electronics Engineers Inc., pp. 893-896, 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 16/08/16. https://doi.org/10.1109/ICEPT.2016.7583273

A novel surface humidity controlled bonder for low-Temperature wafer bonding. / Wang, Chenxi; Xu, Jikai; Liu, Yannan et al.
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. ed. / Keyun Bi; Sheng Liu; Shengjun Zhou. Institute of Electrical and Electronics Engineers Inc., 2016. p. 893-896 7583273 (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - A novel surface humidity controlled bonder for low-Temperature wafer bonding

AU - Wang, Chenxi

AU - Xu, Jikai

AU - Liu, Yannan

AU - Tian, Yanhong

AU - Wang, Chunqing

AU - Suga, Tadatomo

PY - 2016/10/4

Y1 - 2016/10/4

N2 - Hydrophilic bonding is commonly used in the wafer bonding field. Water management is of great importance to obtain good bonding quality over the entire bonded pairs. However, current wafer bonding equipments do not have the function of regulating the surface humidity prior to bonding. It is difficult to make a quantitative study on the role of moistures in the bonding process. In this paper, a novel surface humidity controlled bonder is developed to optimize the water adsorption on the wafer surface prior to bonding and improve the bonding quality using cooling as well as heating functions. For the sufficient surface humidity, the water molecules may bond together via Si-OH groups on the silica surfaces, and then they can compensate the gap between the bonded wafers resulting a weak hydrogen-bonding connected Si-OH···(H2O)x ···HO-Si interface structure forming a good prebonding interface.

AB - Hydrophilic bonding is commonly used in the wafer bonding field. Water management is of great importance to obtain good bonding quality over the entire bonded pairs. However, current wafer bonding equipments do not have the function of regulating the surface humidity prior to bonding. It is difficult to make a quantitative study on the role of moistures in the bonding process. In this paper, a novel surface humidity controlled bonder is developed to optimize the water adsorption on the wafer surface prior to bonding and improve the bonding quality using cooling as well as heating functions. For the sufficient surface humidity, the water molecules may bond together via Si-OH groups on the silica surfaces, and then they can compensate the gap between the bonded wafers resulting a weak hydrogen-bonding connected Si-OH···(H2O)x ···HO-Si interface structure forming a good prebonding interface.

KW - humidity controlled

KW - low temperature

KW - wafer bonder

UR - https://www.scopus.com/pages/publications/84994108308

U2 - 10.1109/ICEPT.2016.7583273

DO - 10.1109/ICEPT.2016.7583273

M3 - 会议稿件

AN - SCOPUS:84994108308

T3 - 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016

SP - 893

EP - 896

BT - 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016

A2 - Bi, Keyun

A2 - Liu, Sheng

A2 - Zhou, Shengjun

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 17th International Conference on Electronic Packaging Technology, ICEPT 2016

Y2 - 16 August 2016 through 19 August 2016

ER -

Wang C, Xu J, Liu Y, Tian Y, Wang C, Suga T. A novel surface humidity controlled bonder for low-Temperature wafer bonding. In Bi K, Liu S, Zhou S, editors, 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 893-896. 7583273. (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016). doi: 10.1109/ICEPT.2016.7583273

A novel surface humidity controlled bonder for low-Temperature wafer bonding

Abstract

Publication series

Conference

UN SDGs

Keywords

Access to Document

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