A Novel Optimization Algorithm for Thermal Design of MCMs

Jie Yang; Ning Ye; Hongyuan Shen; Dong Dong Ye; Wei Zheng; Jia Di

doi:10.1109/CCDC49329.2020.9164110

A Novel Optimization Algorithm for Thermal Design of MCMs

Jie Yang
, Ning Ye
, Hongyuan Shen
, Dong Dong Ye
, Wei Zheng
, Jia Di

Northeastern University China
CAS - Beijing Institute of Control Engineering
University of Arkansas, Fayetteville

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

The layout optimization of components becomes a key role on thermal analysis and design of the multi-chip module (MCM). In this paper a novel modified thermal force-directed placement algorithm (MTFPA) is proposed, with the consideration of the components' size effect and improved the efficiency of TFPA. The simulation results show that, while maintaining optimal components placement, the modified algorithm can effectively overcome the components' overlapping and out-of-boundary problems occurred in the original TFPA, and reduce computation time significantly.

Original language	English
Title of host publication	Proceedings of the 32nd Chinese Control and Decision Conference, CCDC 2020
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1567-1570
Number of pages	4
ISBN (Electronic)	9781728158549
DOIs	https://doi.org/10.1109/CCDC49329.2020.9164110
State	Published - Aug 2020
Externally published	Yes
Event	32nd Chinese Control and Decision Conference, CCDC 2020 - Hefei, China Duration: 22 Aug 2020 → 24 Aug 2020

Publication series

Name	Proceedings of the 32nd Chinese Control and Decision Conference, CCDC 2020

Conference

Conference	32nd Chinese Control and Decision Conference, CCDC 2020
Country/Territory	China
City	Hefei
Period	22/08/20 → 24/08/20

Keywords

MCM
Modified Thermal Force-directed Placement Algorithm
Thermal Layout Optimization

Access to Document

10.1109/CCDC49329.2020.9164110

Cite this

Yang, J., Ye, N., Shen, H., Ye, D. D., Zheng, W., & Di, J. (2020). A Novel Optimization Algorithm for Thermal Design of MCMs. In Proceedings of the 32nd Chinese Control and Decision Conference, CCDC 2020 (pp. 1567-1570). Article 9164110 (Proceedings of the 32nd Chinese Control and Decision Conference, CCDC 2020). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CCDC49329.2020.9164110

@inproceedings{66e2e25d754840bc84e64b53f71f990a,

title = "A Novel Optimization Algorithm for Thermal Design of MCMs",

abstract = "The layout optimization of components becomes a key role on thermal analysis and design of the multi-chip module (MCM). In this paper a novel modified thermal force-directed placement algorithm (MTFPA) is proposed, with the consideration of the components' size effect and improved the efficiency of TFPA. The simulation results show that, while maintaining optimal components placement, the modified algorithm can effectively overcome the components' overlapping and out-of-boundary problems occurred in the original TFPA, and reduce computation time significantly.",

keywords = "MCM, Modified Thermal Force-directed Placement Algorithm, Thermal Layout Optimization",

author = "Jie Yang and Ning Ye and Hongyuan Shen and Ye, \{Dong Dong\} and Wei Zheng and Jia Di",

note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 32nd Chinese Control and Decision Conference, CCDC 2020 ; Conference date: 22-08-2020 Through 24-08-2020",

year = "2020",

month = aug,

doi = "10.1109/CCDC49329.2020.9164110",

language = "英语",

series = "Proceedings of the 32nd Chinese Control and Decision Conference, CCDC 2020",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1567--1570",

booktitle = "Proceedings of the 32nd Chinese Control and Decision Conference, CCDC 2020",

address = "美国",

}

Yang, J, Ye, N, Shen, H, Ye, DD, Zheng, W & Di, J 2020, A Novel Optimization Algorithm for Thermal Design of MCMs. in Proceedings of the 32nd Chinese Control and Decision Conference, CCDC 2020., 9164110, Proceedings of the 32nd Chinese Control and Decision Conference, CCDC 2020, Institute of Electrical and Electronics Engineers Inc., pp. 1567-1570, 32nd Chinese Control and Decision Conference, CCDC 2020, Hefei, China, 22/08/20. https://doi.org/10.1109/CCDC49329.2020.9164110

A Novel Optimization Algorithm for Thermal Design of MCMs. / Yang, Jie; Ye, Ning; Shen, Hongyuan et al.
Proceedings of the 32nd Chinese Control and Decision Conference, CCDC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. p. 1567-1570 9164110 (Proceedings of the 32nd Chinese Control and Decision Conference, CCDC 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - A Novel Optimization Algorithm for Thermal Design of MCMs

AU - Yang, Jie

AU - Ye, Ning

AU - Shen, Hongyuan

AU - Ye, Dong Dong

AU - Zheng, Wei

AU - Di, Jia

PY - 2020/8

Y1 - 2020/8

N2 - The layout optimization of components becomes a key role on thermal analysis and design of the multi-chip module (MCM). In this paper a novel modified thermal force-directed placement algorithm (MTFPA) is proposed, with the consideration of the components' size effect and improved the efficiency of TFPA. The simulation results show that, while maintaining optimal components placement, the modified algorithm can effectively overcome the components' overlapping and out-of-boundary problems occurred in the original TFPA, and reduce computation time significantly.

AB - The layout optimization of components becomes a key role on thermal analysis and design of the multi-chip module (MCM). In this paper a novel modified thermal force-directed placement algorithm (MTFPA) is proposed, with the consideration of the components' size effect and improved the efficiency of TFPA. The simulation results show that, while maintaining optimal components placement, the modified algorithm can effectively overcome the components' overlapping and out-of-boundary problems occurred in the original TFPA, and reduce computation time significantly.

KW - MCM

KW - Modified Thermal Force-directed Placement Algorithm

KW - Thermal Layout Optimization

UR - https://www.scopus.com/pages/publications/85091587527

U2 - 10.1109/CCDC49329.2020.9164110

DO - 10.1109/CCDC49329.2020.9164110

M3 - 会议稿件

AN - SCOPUS:85091587527

T3 - Proceedings of the 32nd Chinese Control and Decision Conference, CCDC 2020

SP - 1567

EP - 1570

BT - Proceedings of the 32nd Chinese Control and Decision Conference, CCDC 2020

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 32nd Chinese Control and Decision Conference, CCDC 2020

Y2 - 22 August 2020 through 24 August 2020

ER -

Yang J, Ye N, Shen H, Ye DD, Zheng W, Di J. A Novel Optimization Algorithm for Thermal Design of MCMs. In Proceedings of the 32nd Chinese Control and Decision Conference, CCDC 2020. Institute of Electrical and Electronics Engineers Inc. 2020. p. 1567-1570. 9164110. (Proceedings of the 32nd Chinese Control and Decision Conference, CCDC 2020). doi: 10.1109/CCDC49329.2020.9164110

A Novel Optimization Algorithm for Thermal Design of MCMs

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Keywords

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