A Novel Nickel-Foam/Tungsten-Powder/Epoxy-Resin Backing Material for Medical Ultrasound Transducers

The miniaturization of medical ultrasound imaging transducers is currently limited by the thick backing layers required to dissipate backward acoustic energy. To address this, a novel hybrid composite backing material was developed by interpenetrating a three-dimensional open-cell nickel foam skeleton with a traditional tungsten-powder/epoxy-resin matrix. Two groups of composite samples with varying pores per inch (PPI) were fabricated, and their acoustic properties were systematically characterized. Experimental results indicated that the 100 PPI composite achieved macroscopic acoustic attenuation coefficients of 62.6 dB/cm at 5 MHz and 84.2 dB/cm at 7.5 MHz. These values are roughly three times higher than conventional backing materials, while maintaining a suitable acoustic impedance of 10.81 MRayl. A 5 MHz transducer utilizing a 5.0 mm layer of this proposed backing achieved a −60 dB two-way pulse-echo insertion loss, effectively eliminating backside interference with performance comparable to a 16.5 mm conventional backing. This structural strategy successfully reduces the required backing axial dimension by over 60% without compromising transducer bandwidth, offering a viable material solution for miniaturized ultrasonic transducers.