@inproceedings{a6c9416fbb2f4a56aecfa2fe55ca6252,
title = "A novel method for bonding strength evaluation",
abstract = "Pull tensile test is commonly used to evaluate the bonding strength. But it is time-consuming using glue to attach the fixtures (jigs). In this paper, a novel method for bonding strength evaluation without using glue is developed based on the principles of the material mechanics and fracture mechanics. After two specimen are bonded by a cross structure, the pulling forces are applied at the relevant positions based on different bonding materials. Then we can obtain the bonding strength according to the accurate fracture position and the pulling force value. In addition, we established a finite element model to verify the evaluation results for the silicon/silicon direct bonding strength. The simulation results of the tensile strength are greatly consistent with our theoretical method.",
keywords = "bonding strength, evaluation method, fixture",
author = "Jikai Xu and Chenxi Wang and Xiaoyun Qi and Yongheng Jia and Xiaoliang Ji and Yanhong Tian and Chunqing Wang",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 18th International Conference on Electronic Packaging Technology, ICEPT 2017 ; Conference date: 16-08-2017 Through 19-08-2017",
year = "2017",
month = sep,
day = "19",
doi = "10.1109/ICEPT.2017.8046742",
language = "英语",
series = "18th International Conference on Electronic Packaging Technology, ICEPT 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1598--1602",
editor = "Chenxi Wang and Yanhong Tian and Tianchun Ye",
booktitle = "18th International Conference on Electronic Packaging Technology, ICEPT 2017",
address = "美国",
}