A new technology for diffusion bonding intermetallic TiAl to steel with composite barrier layers

In this study, intermetallic TiAl and steel are diffusion bonded successfully by using composite barrier layers of titanium/vanadium/copper. The relationship of the bond parameters and tensile strength of the joints is discussed, and the optimum bond parameters were obtained. The reaction products and the interface structures of the joints were investigated by SEM, EPMA, and XRD. In this case, a dual phase Ti₃Al+TiAl layer and a Ti solid solution, which enhances the strength of the joint, are obtained at the TiAl/Ti interface. A formation mechanism at the interface of TiAl/Ti was proposed. The whole reaction process can be divided into three stages. In the first stage, Ti (Al_ss) layer is formed at the interface TiAl/titanium. In the second stage, the continuous diffusion of Al atoms from TiAl to titanium leads to the formation of Ti₃Al, a TiAl+Ti₃Al layer is formed adjacent to TiAl. In the last stage, the thickness of each reaction layer increases with bonding time according to a parabolic law. The interface of TiAl/titanium/vanadium/copper/steel was free from intermetallic compounds and other brittle phases, and the strength of the joint was as high as 420 MPa, very close to that of the TiAl base. This method provides a reliable bonding method of intermetallic TiAl and steel.