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A Monolithically Integrated 3D Wind Sensor with Low Crosstalk Based on a Three-Level Cascade Mechanism

  • Penghong Shi
  • , Gaopeng Xue*
  • , Erzhen Pan
  • , Wenfu Xu
  • , Guochang Liu
  • , Shuo Gao
  • , Yonggang Jiang*
  • , Bing Li
  • *Corresponding author for this work
  • Harbin Institute of Technology Shenzhen
  • Tsinghua University
  • Beihang University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This study presents a monolithically integrated three-dimensional (3D) wind sensor with a low-crosstalk characteristic based on a three-level cascade mechanism for the first time. A center platform for loading a cilium is serially supported by three sets of torsion bars, which are orthogonally configured by utilizing two gimbals. A cilium together with the platform will independently rotate along the X and Y torsion bars by sensing the in-plane wind. The entire suspended platform can sufficiently sense the out-ofplane wind and the downward movement will make the Z torsion bars rotation. This three-level cascade mechanism can achieve superior decoupling characteristics among three axes. Three silicon-based piezoresistive Wheatstone bridge sensors are located at the torsion-bar roots to linearly sense the rotation angles, which are relating to the wind speeds. Wind tunnel tests demonstrate its superior characteristics of the high sensitivities of 0.26,0.22, and 0.06 mV /(m/s)/V in the X, Y, and Z directions, with the corresponding root mean square (RMS) errors of 0.05, 0.08, and 0.28 m/s, respectively. The crosstalk between the X and Y axes is minimal, with a value of ≤ 1.2 m/s. Although the coupling along the Z -axis is relatively higher at 6.6 m/s, the sensor still achieves reliable and independent three-dimensional detection. The demonstrated cascadedgimbal architecture offers a compact and integrable solution for 3D wind-field sensing, with potential for unmanned aerial vehicle (UAV) wind-field mapping and future array-level flow-field measurement.

Original languageEnglish
Title of host publication2026 IEEE 39th International Conference on Micro Electro Mechanical Systems, MEMS 2026
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages998-1001
Number of pages4
ISBN (Electronic)9798331572518
DOIs
StatePublished - 2026
Externally publishedYes
Event39th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2026 - Salzburg, Austria
Duration: 25 Jan 202629 Jan 2026

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

Conference39th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2026
Country/TerritoryAustria
CitySalzburg
Period25/01/2629/01/26

Keywords

  • MEMS wind sensor
  • Wheatstone bridge sensor
  • low crosstalk
  • monolithic integration
  • threelevel cascade mechanism

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