Abstract
This article presents a hybrid thermal modeling approach combining Computational Fluid Dynamics (CFD) and Lumped Parameter Thermal Network (LPTN) for the thermal analysis of in-slot evaporative cooling systems. Firstly, a Volume of Fluid (VOF) based numerical model is established to characterize the boiling heat transfer under various slot geometry parameters. Subsequently, a heat transfer correlation is derived to decouple the effects of heat flux and geometry parameters, which is then integrated into the LPTN model. The comparative results demonstrate that the proposed hybrid model achieves high-fidelity thermal prediction with significantly reduced computational cost. Furthermore, the parametric analysis identifies an optimal channel design that effectively balances the trade-off between convective heat transfer area and volumetric heat generation.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of 2026 IEEE 9th International Electrical and Energy Conference, CIEEC 2026 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 3319-3324 |
| Number of pages | 6 |
| ISBN (Electronic) | 9798331549558 |
| DOIs | |
| State | Published - 2026 |
| Externally published | Yes |
| Event | 9th International Electrical and Energy Conference, CIEEC 2026 - Tianjin, China Duration: 15 May 2026 → 17 May 2026 |
Publication series
| Name | Proceedings of 2026 IEEE 9th International Electrical and Energy Conference, CIEEC 2026 |
|---|
Conference
| Conference | 9th International Electrical and Energy Conference, CIEEC 2026 |
|---|---|
| Country/Territory | China |
| City | Tianjin |
| Period | 15/05/26 → 17/05/26 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 7 Affordable and Clean Energy
Keywords
- hybrid thermal modeling)
- in-slot evaporative cooling
- lumped parameter thermal network (LPTN)
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