A Comparative Study on the Microstructure and Mechanical Properties of Cu6Sn5 and Cu3Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves

H. Y. Zhao; J. H. Liu; Z. L. Li; X. G. Song; Y. X. Zhao; H. W. Niu; H. Tian; H. J. Dong; J. C. Feng

doi:10.1007/s11661-018-4664-6

A Comparative Study on the Microstructure and Mechanical Properties of Cu₆Sn₅ and Cu₃Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves

H. Y. Zhao
, J. H. Liu
, Z. L. Li
, X. G. Song^*
, Y. X. Zhao
, H. W. Niu
, H. Tian
, H. J. Dong
, J. C. Feng

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology Weihai
Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

52 Scopus citations

Abstract

In this study, the microstructure and mechanical properties of Cu₆Sn₅ and Cu₃Sn intermetallic joints, formed by the transient liquid phase (TLP) soldering process with and without the assistance of ultrasonic waves (USWs), were compared. After the application of USWs in the TLP soldering process, Cu-Sn intermetallic compounds (IMCs) exhibited a novel noninterfacial growth pattern in the molten solder interlayer. The resulting Cu₆Sn₅ and Cu₃Sn joints consisted of refined equiaxed IMC grains with average sizes of 3 and 2.3 µm, respectively. The Cu₆Sn₅ grains in the ultrasonically soldered intermetallic joints demonstrated uniform mechanical properties with elastic modulus and hardness values of 123.0 and 5.98 GPa, respectively, while those of Cu₃Sn grains were 133.9 and 5.08 GPa, respectively. The shear strengths of ultrasonically soldered Cu₆Sn₅ and Cu₃Sn joints were measured to be 60 and 65 MPa, respectively, higher than that for reflow-soldered intermetallic joints. Ultrasonically soldered Cu₆Sn₅ and Cu₃Sn joints both exhibited a combination of transgranular and intergranular fractures during shear testing.

Original language	English
Pages (from-to)	2739-2749
Number of pages	11
Journal	Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume	49
Issue number	7
DOIs	https://doi.org/10.1007/s11661-018-4664-6
State	Published - 1 Jul 2018

Access to Document

10.1007/s11661-018-4664-6

Cite this

Zhao, H. Y., Liu, J. H., Li, Z. L., Song, X. G., Zhao, Y. X., Niu, H. W., Tian, H., Dong, H. J., & Feng, J. C. (2018). A Comparative Study on the Microstructure and Mechanical Properties of Cu₆Sn₅ and Cu₃Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves. Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 49(7), 2739-2749. https://doi.org/10.1007/s11661-018-4664-6

@article{2be60ce415394320973a1657ffd4b347,

title = "A Comparative Study on the Microstructure and Mechanical Properties of Cu6Sn5 and Cu3Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves",

abstract = "In this study, the microstructure and mechanical properties of Cu6Sn5 and Cu3Sn intermetallic joints, formed by the transient liquid phase (TLP) soldering process with and without the assistance of ultrasonic waves (USWs), were compared. After the application of USWs in the TLP soldering process, Cu-Sn intermetallic compounds (IMCs) exhibited a novel noninterfacial growth pattern in the molten solder interlayer. The resulting Cu6Sn5 and Cu3Sn joints consisted of refined equiaxed IMC grains with average sizes of 3 and 2.3 µm, respectively. The Cu6Sn5 grains in the ultrasonically soldered intermetallic joints demonstrated uniform mechanical properties with elastic modulus and hardness values of 123.0 and 5.98 GPa, respectively, while those of Cu3Sn grains were 133.9 and 5.08 GPa, respectively. The shear strengths of ultrasonically soldered Cu6Sn5 and Cu3Sn joints were measured to be 60 and 65 MPa, respectively, higher than that for reflow-soldered intermetallic joints. Ultrasonically soldered Cu6Sn5 and Cu3Sn joints both exhibited a combination of transgranular and intergranular fractures during shear testing.",

author = "Zhao, \{H. Y.\} and Liu, \{J. H.\} and Li, \{Z. L.\} and Song, \{X. G.\} and Zhao, \{Y. X.\} and Niu, \{H. W.\} and H. Tian and Dong, \{H. J.\} and Feng, \{J. C.\}",

note = "Publisher Copyright: {\textcopyright} 2018, The Minerals, Metals \& Materials Society and ASM International.",

year = "2018",

month = jul,

day = "1",

doi = "10.1007/s11661-018-4664-6",

language = "英语",

volume = "49",

pages = "2739--2749",

journal = "Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science",

issn = "1073-5623",

publisher = "Springer",

number = "7",

}

Zhao, HY, Liu, JH, Li, ZL , Song, XG, Zhao, YX, Niu, HW, Tian, H, Dong, HJ & Feng, JC 2018, 'A Comparative Study on the Microstructure and Mechanical Properties of Cu₆Sn₅ and Cu₃Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves', Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 49, no. 7, pp. 2739-2749. https://doi.org/10.1007/s11661-018-4664-6

A Comparative Study on the Microstructure and Mechanical Properties of Cu₆Sn₅ and Cu₃Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves. / Zhao, H. Y.; Liu, J. H.; Li, Z. L. et al.
In: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, Vol. 49, No. 7, 01.07.2018, p. 2739-2749.

Research output: Contribution to journal › Article › peer-review

TY - JOUR

T1 - A Comparative Study on the Microstructure and Mechanical Properties of Cu6Sn5 and Cu3Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves

AU - Zhao, H. Y.

AU - Liu, J. H.

AU - Li, Z. L.

AU - Song, X. G.

AU - Zhao, Y. X.

AU - Niu, H. W.

AU - Tian, H.

AU - Dong, H. J.

AU - Feng, J. C.

PY - 2018/7/1

Y1 - 2018/7/1

N2 - In this study, the microstructure and mechanical properties of Cu6Sn5 and Cu3Sn intermetallic joints, formed by the transient liquid phase (TLP) soldering process with and without the assistance of ultrasonic waves (USWs), were compared. After the application of USWs in the TLP soldering process, Cu-Sn intermetallic compounds (IMCs) exhibited a novel noninterfacial growth pattern in the molten solder interlayer. The resulting Cu6Sn5 and Cu3Sn joints consisted of refined equiaxed IMC grains with average sizes of 3 and 2.3 µm, respectively. The Cu6Sn5 grains in the ultrasonically soldered intermetallic joints demonstrated uniform mechanical properties with elastic modulus and hardness values of 123.0 and 5.98 GPa, respectively, while those of Cu3Sn grains were 133.9 and 5.08 GPa, respectively. The shear strengths of ultrasonically soldered Cu6Sn5 and Cu3Sn joints were measured to be 60 and 65 MPa, respectively, higher than that for reflow-soldered intermetallic joints. Ultrasonically soldered Cu6Sn5 and Cu3Sn joints both exhibited a combination of transgranular and intergranular fractures during shear testing.

AB - In this study, the microstructure and mechanical properties of Cu6Sn5 and Cu3Sn intermetallic joints, formed by the transient liquid phase (TLP) soldering process with and without the assistance of ultrasonic waves (USWs), were compared. After the application of USWs in the TLP soldering process, Cu-Sn intermetallic compounds (IMCs) exhibited a novel noninterfacial growth pattern in the molten solder interlayer. The resulting Cu6Sn5 and Cu3Sn joints consisted of refined equiaxed IMC grains with average sizes of 3 and 2.3 µm, respectively. The Cu6Sn5 grains in the ultrasonically soldered intermetallic joints demonstrated uniform mechanical properties with elastic modulus and hardness values of 123.0 and 5.98 GPa, respectively, while those of Cu3Sn grains were 133.9 and 5.08 GPa, respectively. The shear strengths of ultrasonically soldered Cu6Sn5 and Cu3Sn joints were measured to be 60 and 65 MPa, respectively, higher than that for reflow-soldered intermetallic joints. Ultrasonically soldered Cu6Sn5 and Cu3Sn joints both exhibited a combination of transgranular and intergranular fractures during shear testing.

UR - https://www.scopus.com/pages/publications/85046765854

U2 - 10.1007/s11661-018-4664-6

DO - 10.1007/s11661-018-4664-6

M3 - 文章

AN - SCOPUS:85046765854

SN - 1073-5623

VL - 49

SP - 2739

EP - 2749

JO - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

JF - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

IS - 7

ER -

A Comparative Study on the Microstructure and Mechanical Properties of Cu₆Sn₅ and Cu₃Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves

Abstract

Access to Document

Other files and links

Fingerprint

Cite this