Abstract
High-frequency ultrasonic energy can effectively remove sub-micron particles without damaging the precise structure of different materials. Thus,this form of energy has broad prospects for applications in fields such as semiconductor wafer cleaning. In this study,we determined the thickness of stainless steel with a high-efficiency resonance of the piezoelectric ceramic at a resonant frequency of 514 kHz was 5 mm based on the finite element method as computed with the COMSOL simulation software. We established a linear array distribution simulation model of the piezoelectric ceramic acoustic pressure. We then examined the simulation in terms of the propagation path and acoustic pressure distribution of the high-frequency ultrasonic waves. The results of an experimental evaluation of the proposed approach show that the maximum relative deviation between the experimentally recorded values and those obtained in the simulation of the resonator's resonant frequency was only 0. 79%,and the impedance curve of the simulation was highly consistent with the measured results. The sound pressure was the highest at the resonant frequency driven by a single transducer,and it was largely consistent with the trends in the variation of simulation sound pressure at different frequency points. The driving voltage was nonlinearly positively correlated with the test sound pressure,and the acoustic pressure of the linear array transducer was primarily concentrated within the radiation surface of the transducer. Moreover, the acoustic pressure in the outer area was significantly reduced,which confirms that the ultrasonic wave propagation of the high-frequency transducer exhibited good directionality.
| Translated title of the contribution | An Investigation of the Sound Pressure of a High-Frequency Ultrasonic Cleaning Transducer |
|---|---|
| Original language | Chinese (Traditional) |
| Pages (from-to) | 30-36 |
| Number of pages | 7 |
| Journal | Yadian Yu Shengguang/Piezoelectrics and Acoustooptics |
| Volume | 48 |
| Issue number | 1 |
| DOIs | |
| State | Published - Feb 2026 |
| Externally published | Yes |
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