Abstract
The Cu-based metal coating was fabricated on AlN ceramic substrate by pulsed YAG laser and the process was optimized by adjusting laser cladding process parameters. Preheating and slow cooling rate were utilized in the process to reduce the cracking tendency of ceramic substrate. The reactive metal titanium powder was added to enhance wettability of AlN ceramic substrate. The results showed that transition layer appeared between ceramic substrate and Cu-based metal and the thickness of the transition layer increased with the increasing current. The content of titanium increased firstly and then decreased from the ceramic substrate to the Cu-based alloy coating, so did that of oxygen element, while the other elements including Cu, Al and N had presented a smooth trasition. The metallurgical bonding was produced between the ceramic substrate and the cladding powder with different products including TiO2, Ti3Al, Cu4Ti5, Al2TiO5 and Ti2N.
| Translated title of the contribution | Fabricating process and bonding mechanism of Cu-based alloy coatings on ceramic |
|---|---|
| Original language | Chinese (Traditional) |
| Pages (from-to) | 116-120 |
| Number of pages | 5 |
| Journal | Hanjie Xuebao/Transactions of the China Welding Institution |
| Volume | 39 |
| Issue number | 6 |
| DOIs | |
| State | Published - 25 Jun 2018 |
| Externally published | Yes |
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