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陶瓷表面制备铜基金属覆层工艺及结合机理

Translated title of the contribution: Fabricating process and bonding mechanism of Cu-based alloy coatings on ceramic
  • Jialiang Zhou
  • , Fengyuan Shu
  • , Qiuyue Jiang
  • , Hongyun Zhao
  • , Wenxiong He
  • Harbin Institute of Technology Weihai
  • Changchun Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

The Cu-based metal coating was fabricated on AlN ceramic substrate by pulsed YAG laser and the process was optimized by adjusting laser cladding process parameters. Preheating and slow cooling rate were utilized in the process to reduce the cracking tendency of ceramic substrate. The reactive metal titanium powder was added to enhance wettability of AlN ceramic substrate. The results showed that transition layer appeared between ceramic substrate and Cu-based metal and the thickness of the transition layer increased with the increasing current. The content of titanium increased firstly and then decreased from the ceramic substrate to the Cu-based alloy coating, so did that of oxygen element, while the other elements including Cu, Al and N had presented a smooth trasition. The metallurgical bonding was produced between the ceramic substrate and the cladding powder with different products including TiO2, Ti3Al, Cu4Ti5, Al2TiO5 and Ti2N.

Translated title of the contributionFabricating process and bonding mechanism of Cu-based alloy coatings on ceramic
Original languageChinese (Traditional)
Pages (from-to)116-120
Number of pages5
JournalHanjie Xuebao/Transactions of the China Welding Institution
Volume39
Issue number6
DOIs
StatePublished - 25 Jun 2018
Externally publishedYes

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