Skip to main navigation Skip to search Skip to main content

连接温度对高铌TiAl合金扩散接头组织和强度的影响

Translated title of the contribution: Effect of Bonding Temperature on Microstructure and Strength of High Nb Containing TiAl Alloy Diffusion Joints
  • Panfei Bao
  • , Xiaoguo Song*
  • , Xinbo Wang
  • , Shengpeng Hu
  • , Heli Peng
  • , Zhongquan Li
  • *Corresponding author for this work
  • Harbin Institute of Technology
  • Harbin Institute of Technology Weihai
  • Shanghai Aerospace Precision Machinery Institute

Research output: Contribution to journalArticlepeer-review

Abstract

The direct diffusion bonding of high Nb containing TiAl alloy (TAN) was conducted at temperatures of 1000~1200℃ for 90 min under 25 MPa in vacuum. The effect of bonding temperature on interfacial microstructure and mechanical property of joints was studied and the microstructure of joints was analyzed by SEM, EDS, XRD and EBSD. The results indicate that the distinct interface can be seen when the temperature is below 1100℃, and the temperature higher than 1100℃ promotes disappearance of the interface; recrystallized grains are observed at bonding interface. The number and size of grains increase with the increase of temperature and a lot of α2 phases appear in the area of recrystallization; when the connection temperature reaches 1150℃, the average shear strength of joints reaches a maximum of 105 MPa.

Translated title of the contributionEffect of Bonding Temperature on Microstructure and Strength of High Nb Containing TiAl Alloy Diffusion Joints
Original languageChinese (Traditional)
Pages (from-to)2132-2136
Number of pages5
JournalXiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
Volume47
Issue number7
StatePublished - 1 Jul 2018

Fingerprint

Dive into the research topics of 'Effect of Bonding Temperature on Microstructure and Strength of High Nb Containing TiAl Alloy Diffusion Joints'. Together they form a unique fingerprint.

Cite this