芯片金属互连中电镀添加剂的理论与实验研究

Electroplating technology is the key technology to achieve metal interconnects in chip fabrication, and adding proper additives into the electroplating bath is crucial to obtain high-quality interconnects. The research methods are systematically summarized in this work. Firstly, the electrochemical research methods are introduced and electrochemical methods are divided into three categories: voltammetry and impedance analysis, galvanostatic measurement analysis, other electrochemical methods. The application of these electrochemical methods and drawbacks are summarized. In the second part, the application of theoretical calculations in additive research is introduced from the aspects of molecular dynamics simulation (MD) and quantum chemical calculation (QC). In the final part, the application of various advanced characterization techniques is illustrated. The application of advanced characterization on studying additive mechanism is demonstrated from three aspects: spectral research methods, electron microscopy methods and secondary ion-mass spectrometry methods. Summarizing different research methods for electroplating additives can provide the guidance for the subsequent research on additive screening and mechanism.