相场模拟在电子封装可靠性中的应用

With the rapid advancement of electronic devices towards miniaturization, high integration, and multifunctionality, the complexity of chip packaging has increased significantly. As packaging density continues to rise and solder joint size decreases, the operating conditions of electronic components in service become increasingly demanding. Consequently, the reliability of micro-interconnect solder joints has become a critical concern, with solder joint failure emerging as one of the key bottlenecks hindering the further development of electronic packaging techniques. This paper focuses on the failure behavior of micro-interconnect solder joints and reviews several common reliability issues in electronic packaging. Based on the selection of different phase-field variables, several typical phase-field modeling approaches are summarized. Furthermore, the paper analyzes the application and current progress of phase-field methods in simulating several representative failure modes, such as electromigration, through-silicon vias (TSVs), and interfacial intermetallic compound (IMC) growth. Finally, the potential of phase-field modeling in studying micro-scale failure mechanisms is discussed, along with its future development trends in multi-physics coupling, data-driven modeling, and engineering applications. This work aims to provide systematic references and methodological support for both theoretical analysis and practical engineering studies on the failure behavior of micro-interconnect solder joints.