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有机溶剂保护对Al/Ni扩散连接的影响规律研究

Translated title of the contribution: Influence of Organic Solvent Surface Protection on Diffusion Bonding of Pure Aluminum to Pure Nickel
  • Rui Li
  • , Jian Cao*
  • , Yifeng Wang
  • , Xiangyu Dai
  • , Jicai Feng
  • *Corresponding author for this work
  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

Diffusion bonding of pure aluminum to pure nickel by organic solvent surface protection was investigated at various temperatures. The interfacial microstructure of Al/Ni diffusion bonded joint was confirmed to be Al/Al3Ni2/Ni by scanning electron microscope, energy spectrum analysis and X-ray diffraction (XRD) analysis. The organic solvent was used to protect the "clean surface" against re-oxidation prior to diffusion bonding. Under optimum conditions, the joints with higher shear strength were obtained. As the temperature increases, the thickness of the reaction layers increases gradually. The highest shear strength obtained by organic solvent surface protection bonding is 17.83 MPa under 2 MPa for 60 min at 490 °C, which is 55% higher than those obtained by conventional diffusion bonding.

Translated title of the contributionInfluence of Organic Solvent Surface Protection on Diffusion Bonding of Pure Aluminum to Pure Nickel
Original languageChinese (Traditional)
Pages (from-to)3849-3952
Number of pages104
JournalXiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
Volume46
Issue number12
StatePublished - 1 Dec 2017

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