Abstract
Cu@Ag micron particles were synthesized by replacement reaction, and the most excellent parameters of reaction process were determined via altering temperature, proportion and time during the reaction. Nano-scale Ag particles with uniform size and good dispersibility were synthesized, the average diameter was about 14.33 nm. The mixed proportion of these two kinds of particles was obtained by calculation, which was used for the preparation of mixed solder paste. The sandwich structure was sintered by high frequency induction heating, and direct Cu bonding was realized successfully. Moreover, the influence of electromagnetic power on the micro-interface has been discussed. As the result, increasing electromagnetic power can reduce defects such as pores at the interface, the densification can be improved significantly. The shear strength of bare Cu joint structure was achieved about 48 MPa when bonded at 26 kW for 15 s.
| Translated title of the contribution | Fabrication of Micron-Cu@Ag and Nano-Ag Particle Connection Material and Study of High Frequency Induction Rapid Sintering Method |
|---|---|
| Original language | Chinese (Traditional) |
| Pages (from-to) | 26-33 |
| Number of pages | 8 |
| Journal | Jixie Gongcheng Xuebao/Chinese Journal of Mechanical Engineering |
| Volume | 58 |
| Issue number | 2 |
| DOIs | |
| State | Published - 20 Jan 2022 |
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