异种金属材料扩散连接研究进展

To meet the dual requirements of structural performance and lightweight design in modern high-end equipment, high-reliability joining technologies for dissimilar metals have become one of the core challenges in the field of advanced manufacturing. Diffusion bonding, as an advanced solid-state joining process, enables interfacial atomic interdiffusion through thermo-mechanical coupling to achieve metallurgical bonding. It is particularly suitable for joining of dissimilar materials with significantly different physical and chemical properties, and holds unique value in high-end industrial fields such as aerospace, new energy, and nuclear industry. This paper systematically reviews the current state of research and progress in diffusion bonding of dissimilar metals. Firstly, based on the metallurgical compatibility of material combinations, dissimilar metal diffusion bonding systems are categorized into three types: systems with good compatibility (e. g., dissimilar steels, steel/nickel, etc. ), systems with poor compatibility ( e. g., copper/iron, tungsten/copper, etc. ), and systems prone to forming brittle intermetallic compounds (IMCs) (e. g., steel/titanium, titanium/nickel, aluminum/steel, etc. ). The bonding mechanisms and principal technical challenges for each category are discussed in detail. Secondly, the study focuses on combinations of key engineering materials such as steel, nickel, titanium, copper, aluminum, and magnesium alloys, and examines strategies for controlling interfacial reactions, IMC growth, and residual stresses through optimized process parameters, innovative process methods, interlayer design, and surface pretreatment. Research shows that selecting appropriate interlayers ( e. g., Ni, Cu, Ag, high-entropy alloys, etc. ) can effectively suppress the formation of harmful IMCs and alleviate thermal stresses caused by differences in thermal expansion coefficients, thereby significantly improving joint performance. Pretreatment techniques such as surface nanocrystallization enable high-quality low-temperature bonding while minimizing thermal damage to materials. Finally, this paper highlights future key research directions in the field, including multi-scale simulations of interfacial reaction kinetics, development of low-stress and defect-free new processes, and the application of artificial intelligence in material design and process optimization, aiming to provide theoretical references and technical support for promoting the wider application of diffusion bonding technology in high-end industrial fields.