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基于阈值电压的 IGBT 芯片疲劳失效模型

Translated title of the contribution: Fatigue Failure Model of IGBT Chip Based on Threshold Voltage
  • You Li
  • , Jiwei Cao*
  • , Guangyao Hao
  • , Ge Yan
  • , Hongxiao Liu
  • *Corresponding author for this work
  • China Institute of Marine Technology and Economy
  • School of Electrical Engineering and Automation, Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

In order to effectively evaluate the health status of IGBT during its whole life cycle, the fatigue failure mechanism of IGBT chip was studied based on the theory of semiconductor physics, and the effect of charge density at gate interface on threshold voltage was analyzed. Taking the threshold voltage as the failure characteristic quantity of IGBT, the fatigue failure model of IGBT chip was established on the basis of studying the change rule of threshold voltage with fatigue failure time. An IGBT threshold voltage test platform was built, and IGBT aging experiments were performed to verify that the model proposed in this paper can accurately characterize and estimate the aging degree of IGBT chips, and the correctness and rationality of the failure model were verified.

Translated title of the contributionFatigue Failure Model of IGBT Chip Based on Threshold Voltage
Original languageChinese (Traditional)
Pages (from-to)865-875
Number of pages11
JournalYingyong Kexue Xuebao/Journal of Applied Sciences
Volume40
Issue number5
DOIs
StatePublished - Sep 2022
Externally publishedYes

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