基于自定义探针的绑定前TSV测试方法

Abstract:A novel pre-bond through-silicon via(TSV) test method using customized pad is proposed. By using IEEE1149.1 compatible design for testability (DfT) structure, the test circuit is connected with TSV front side and the custom pad is connected with TSV end side. As a result, a closed loop is built to implement TSV double-end test, making the test results independent of fault-location. Moreover, different from capturing TSV test results in transient process for conventional methods, the proposed method captures the TSV voltage when it is charged to steady-state, which makes the test results robust against process variation to a certain extent. The effectiveness of the proposed method is proved through HSPICE simulation. And the overall assessment on test resolution, test time, and the DfT area cost are analyzed and evaluated.