半球谐振子装配倾角误差对频率裂解的影响分析

The precise assembly process is the key technology to ensure the high-precision performance of the hemispherical resonant gyroscope. The study of the influence of assembly errors on gyroscope performance can provide theoretical guidance and basis for perfecting and optimizing process parameters. The effect of eccentricity, tilt errors in the assembly process on the frequency cracking of the harmonic oscillator is studied, and a mathematical model of the effect of tilt assembly errors on frequency cracking of harmonic oscillator is established. Firstly, the lip and the polar plate of the harmonic oscillator are used as the equivalent capacitance, and the relationship model between the assembly tilt error and the equivalent capacitance is established. Then, based on the mathematical model between the voltage across the equivalent capacitance and the electrostatic force of the hemispherical harmonic oscillator, the influence of the uneven electrostatic force on the stiffness of the harmonic oscillator is analyzed. Finally, a mathematical model is established to analyze the influence of the stiffness disturbance on the frequency splitting. The research results show that for a fused silica hemispherical resonator with a diameter of 30 mm, when the inclination error of the assembly with the base is 1 arc minute, the frequency splitting introduced by the inclination error is on the order of 10^-4 Hz. The analysis of the influence of the tilt error on the frequency splitting of the harmonic oscillator provides theoretical guidance and basis for the precision assembly process and process parameter configuration of the high-precision hemispherical resonator gyroscope.