Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 3 Good Health and Well-being -
SDG 7 Affordable and Clean Energy -
SDG 9 Industry, Innovation, and Infrastructure -
SDG 14 Life Below Water
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Emergent rotational order and reentrant global order of Vicsek agents in a complex noise environment
Khan, M. Y., Babu, S. B. & Wang, W., Mar 2026, In: Physical Review E. 113, 3, 034103.Research output: Contribution to journal › Article › peer-review
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Polymer-Mediated Assembly from Core–Shell Particles to Tunable Structures and Microrotors
Tong, J., Zang, S., Liu, J., Xu, Z., Hu, X., Bai, X., Bai, X., Ma, C., Wang, W. & Huang, J., 17 Feb 2026, In: Langmuir. 42, 6, p. 4333-4341 9 p.Research output: Contribution to journal › Article › peer-review
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Radial illumination enables the concentration, dispersion, lateral transport, and sorting of photocatalytic TiO2 microspheres
Lin, R., Fu, L., Yang, F., Lou, K. & Wang, W., 6 Jan 2026, In: Chemical Communications. 62, 1, p. 214-217 4 p.Research output: Contribution to journal › Article › peer-review
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Strength improvement and ductility preservation of Sn-Ag-Cu solder alloy induced by Bi and Mn microalloying
Liang, J., Tian, R., Wang, W., Wang, S., Feng, J., Wang, S., Yu, M., Wu, P., Deng, T. & Tian, Y., Apr 2026, In: Materials Science and Engineering: A. 958, 150010.Research output: Contribution to journal › Article › peer-review
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A novel lead-free solder alloy with high strength-ductility by doping rare Bi and Zr into SnAgCu solder alloy
Liang, J., Fu, P., Tian, R., Wang, N., Wang, W., Xiang, G. & Tian, Y., 2025, 2025 26th International Conference on Electronic Packaging Technology, ICEPT 2025. 2025 ed. Institute of Electrical and Electronics Engineers Inc.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review